Course List - Fall 2009

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 5: Engineering Programming Languages: Higher-level languages for engineering design and problem solving; object-oriented programming in C++ and UNIX systems programming.

Topic 6: Operating Systems Input/output systems calls, drivers and descriptors, and integrated circuits. Design and implementation of hardware and software for a UNIX-like operating system.

Topic 7: Introduction to Pattern Recognition and Computer Vision: Pattern recognition topics, including Bayesian decision theory, maximum likelihood and estimation, nonparametric techniques, and linear discriminant functions. Computer vision topics, including geometric camera models and calibration, geometry of multiple views and stereopsis, structure from motion, and tracking. Emphasis varies each semester.

Topic 8: Computer Vision Systems: Discussion of current research results and exploration of new directions in computer vision systems. Includes linear discriminant functions, nonmetric methods, unsupervised learning and clustering, model-based vision, segmentation using probabilistic methods, and content-based image and video analysis. Application of the techniques to real-world vision systems. Emphasis varies each semester.

Topic 9: Artificial Neural Systems: Feed-forward networks, distributed associative memory, recurrent networks, self-organization, parallel implementation, and applications.

Topic 10: Data Mining: Analyzing large data sets for interesting and useful information. Includes online analytical processing, finding association rules, clustering, classification, and function approximations. Scalability of algorithms and real-life applications.

Topic 11: Mining the Web: Analysis of data and information available from the World Wide Web. Exploiting the hyperlink structure of the Web for developing better search engines. Content analysis, information retrieval, clustering, and hierarchical categorization of Web documents. Web usage mining. Collaborative filtering and personalizing the Web. Additional prerequisite: Electrical Engineering 380L (Topic 10: Data Mining) or Computer Sciences 391L.

May be repeated for credit when the topics vary. Prerequisite: Graduate standing, and Electrical Engineering 380K or consent of instructor.

Topic 1: Nonlinear Systems: Input-Output Properties:

Topic 2: Nonlinear Systems: Geometric Theory:

Topic 3: Adaptive Control Systems:

Topic 4: Learning Systems and Cybernetic Machines:

Topic 5: Stochastic Control Theory: Dynamic programming in finite and infinite horizon, models with imperfect state information, ergodic control problems, adaptive and risk-sensitive control. Additional prerequisite: Electrical Engineering 381J.

Topic 7: Computer Control of Manufacturing Systems:

Topic 8: Algorithms for Parallel and Distributed Computation: Same as Computational and Applied Mathematics 380N.

Topic 9: Fundamentals of Robotics and Mechatronics: Theory of robotics and mechatronics, with emphasis on control, sensing, actuation, low- and high-level vision. Introduction to manipulator geometry, kinematics, dynamics, and planning of trajectories. Robotics laboratory.

Topic 10: Robotics II:

Topic 11: Optimization in Engineering Systems: Formulation and solution of continuous optimization problems in engineering design.

May be repeated for credit when the topics vary. Prerequisite: Graduate standing, and Electrical Engineering 380K or consent of instructor.

Topic 1: Nonlinear Systems: Input-Output Properties:

Topic 2: Nonlinear Systems: Geometric Theory:

Topic 3: Adaptive Control Systems:

Topic 4: Learning Systems and Cybernetic Machines:

Topic 5: Stochastic Control Theory: Dynamic programming in finite and infinite horizon, models with imperfect state information, ergodic control problems, adaptive and risk-sensitive control. Additional prerequisite: Electrical Engineering 381J.

Topic 7: Computer Control of Manufacturing Systems:

Topic 8: Algorithms for Parallel and Distributed Computation: Same as Computational and Applied Mathematics 380N.

Topic 9: Fundamentals of Robotics and Mechatronics: Theory of robotics and mechatronics, with emphasis on control, sensing, actuation, low- and high-level vision. Introduction to manipulator geometry, kinematics, dynamics, and planning of trajectories. Robotics laboratory.

Topic 10: Robotics II:

Topic 11: Optimization in Engineering Systems: Formulation and solution of continuous optimization problems in engineering design.

Probability spaces, random variables, expectation, conditional expectation, stochastic convergence, characteristic functions, and limit theorems. Introduction to Markov and Gaussian processes, stationary processes, spectral representation, ergodicity, renewal processes, martingales, and applications to estimation, prediction, and queueing theory. Prerequisite: Graduate standing, and Electrical Engineering 351K or the equivalent.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Engineering Design of Software and Software Systems: The software development process; selection and application of software design methods; evaluation of software designs.

Topic 2: Creation and Maintenance of Distributed Software Systems: Creation of large distributed software applications, with emphasis on specification, failure models, correctness, security.

Topic 3: Verification and Validation of Software: Evaluation of software for correctness, efficiency, performance, and reliability.

Topic 4: Software/Hardware Engineering Project Management: Requirements for a project management plan; role of the manager of the software development life cycle; economic and customer-driven factors.

Topic 5: Large Software/Hardware/Communications Systems Engineering: Techniques used to specify and design systems of software, hardware, and communications components. Creation of a requirements document and system specification.

Topic 6: Software for Highly-Available Distributed Applications:

Topic 7: Software Architectures: Software engineering approaches; scenario-based engineering processes to analyze problem domain; domain modeling and representations; creation of component-based reference architecture providing an object-oriented representation of system requirements.

Topic 8: Methodologies for Hardware/Software Codesign: Techniques used to design complex hardware/software systems; emphasis on specification, modeling, estimation, partitioning, verification/validation, and synthesis.

Topic 9: Embedded Software Systems: Dataflow models, uniprocessor and multiprocessor scheduling, hardware/software codesign, hierarchical finite state machines, synchronous languages, reactive systems, synchronous/reactive languages, heterogeneous systems.

Topic 10: Empirical Studies in Software Engineering:

Topic 11: Requirements Engineering:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Engineering Design of Software and Software Systems: The software development process; selection and application of software design methods; evaluation of software designs.

Topic 2: Creation and Maintenance of Distributed Software Systems: Creation of large distributed software applications, with emphasis on specification, failure models, correctness, security.

Topic 3: Verification and Validation of Software: Evaluation of software for correctness, efficiency, performance, and reliability.

Topic 4: Software/Hardware Engineering Project Management: Requirements for a project management plan; role of the manager of the software development life cycle; economic and customer-driven factors.

Topic 5: Large Software/Hardware/Communications Systems Engineering: Techniques used to specify and design systems of software, hardware, and communications components. Creation of a requirements document and system specification.

Topic 6: Software for Highly-Available Distributed Applications:

Topic 7: Software Architectures: Software engineering approaches; scenario-based engineering processes to analyze problem domain; domain modeling and representations; creation of component-based reference architecture providing an object-oriented representation of system requirements.

Topic 8: Methodologies for Hardware/Software Codesign: Techniques used to design complex hardware/software systems; emphasis on specification, modeling, estimation, partitioning, verification/validation, and synthesis.

Topic 9: Embedded Software Systems: Dataflow models, uniprocessor and multiprocessor scheduling, hardware/software codesign, hierarchical finite state machines, synchronous languages, reactive systems, synchronous/reactive languages, heterogeneous systems.

Topic 10: Empirical Studies in Software Engineering:

Topic 11: Requirements Engineering:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Engineering Design of Software and Software Systems: The software development process; selection and application of software design methods; evaluation of software designs.

Topic 2: Creation and Maintenance of Distributed Software Systems: Creation of large distributed software applications, with emphasis on specification, failure models, correctness, security.

Topic 3: Verification and Validation of Software: Evaluation of software for correctness, efficiency, performance, and reliability.

Topic 4: Software/Hardware Engineering Project Management: Requirements for a project management plan; role of the manager of the software development life cycle; economic and customer-driven factors.

Topic 5: Large Software/Hardware/Communications Systems Engineering: Techniques used to specify and design systems of software, hardware, and communications components. Creation of a requirements document and system specification.

Topic 6: Software for Highly-Available Distributed Applications:

Topic 7: Software Architectures: Software engineering approaches; scenario-based engineering processes to analyze problem domain; domain modeling and representations; creation of component-based reference architecture providing an object-oriented representation of system requirements.

Topic 8: Methodologies for Hardware/Software Codesign: Techniques used to design complex hardware/software systems; emphasis on specification, modeling, estimation, partitioning, verification/validation, and synthesis.

Topic 9: Embedded Software Systems: Dataflow models, uniprocessor and multiprocessor scheduling, hardware/software codesign, hierarchical finite state machines, synchronous languages, reactive systems, synchronous/reactive languages, heterogeneous systems.

Topic 10: Empirical Studies in Software Engineering:

Topic 11: Requirements Engineering:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Engineering Design of Software and Software Systems: The software development process; selection and application of software design methods; evaluation of software designs.

Topic 2: Creation and Maintenance of Distributed Software Systems: Creation of large distributed software applications, with emphasis on specification, failure models, correctness, security.

Topic 3: Verification and Validation of Software: Evaluation of software for correctness, efficiency, performance, and reliability.

Topic 4: Software/Hardware Engineering Project Management: Requirements for a project management plan; role of the manager of the software development life cycle; economic and customer-driven factors.

Topic 5: Large Software/Hardware/Communications Systems Engineering: Techniques used to specify and design systems of software, hardware, and communications components. Creation of a requirements document and system specification.

Topic 6: Software for Highly-Available Distributed Applications:

Topic 7: Software Architectures: Software engineering approaches; scenario-based engineering processes to analyze problem domain; domain modeling and representations; creation of component-based reference architecture providing an object-oriented representation of system requirements.

Topic 8: Methodologies for Hardware/Software Codesign: Techniques used to design complex hardware/software systems; emphasis on specification, modeling, estimation, partitioning, verification/validation, and synthesis.

Topic 9: Embedded Software Systems: Dataflow models, uniprocessor and multiprocessor scheduling, hardware/software codesign, hierarchical finite state machines, synchronous languages, reactive systems, synchronous/reactive languages, heterogeneous systems.

Topic 10: Empirical Studies in Software Engineering:

Topic 11: Requirements Engineering:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: VLSI Testing: Hardware and software reliability analysis of digital systems; testing, design for testability, self-diagnosis, fault-tolerant logic design, error-detecting and error-correcting codes.

Topic 2: Dependable Computing: Design techniques for reliable, fault-tolerant, fail-safe and fail-soft systems; fault diagnosis and fault avoidance methods at program and system levels; experimental and commercial fault-tolerant computer systems.

Topic 4: Digital Systems Simulation: Uses and limitations of simulation algorithms for digital circuits and systems.

Topic 7: VLSI I: CMOS technology; structured digital circuits; VLSI systems; computer-aided design tools and theory for design automation; chip design.

Topic 8: VLSI II: Microelectronic systems architecture; VLSI circuit testing methods; integration of heterogeneous computer-aided design tools; wafer scale integration; advanced high-speed circuit design and integration.

Topic 9: Simulation Methods in CAD/VLSI: Techniques and algorithms for simulating large-scale digital and analog circuits.

Topic 10: Synthesis of Digital Systems: Automatic generation of gate-level implementations from HDL specifications; optimization of two-level, multilevel, and sequential circuits for area, speed, and testability.

Topic 11: Verification of Digital Systems: Automatic verification of digital systems; formal models and specifications, equivalence checking, design verification, temporal logic, BDDs, logical foundations, automata theory, recent developments.

Topic 12: System Design Metrics: Analysis of design at chip, board, and system levels; life cycle implications of design decisions, including design for testability effects on production and field service; economic and customer-driven factors.

Topic 13: Analysis and Design of Digital Integrated Circuits:

Topic 14: Analog Integrated Circuit Design:

Topic 15: Computer Performance Evaluation and Benchmarking: Performance metrics, benchmarks, measurement tools and techniques, simulation, trace generation, sampling, analytical modeling, workload characterization, statistical methods to compare alternatives, linear regression, and design of experiments.

Topic 16: Application-Specific Processing:

Topic 17: High-Level Synthesis of Digital Systems:

Topic 18: Java Processing: The Java run-time environment, Java Virtual Machine, processing Java in interpreted and JIT compilation modes, Java processors, Java benchmarks, characterization of Java workloads, performance impact of Java, optimizing microprocessors for Java.

Topic 19: Mixed-Signal System Design and Modeling:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: VLSI Testing: Hardware and software reliability analysis of digital systems; testing, design for testability, self-diagnosis, fault-tolerant logic design, error-detecting and error-correcting codes.

Topic 2: Dependable Computing: Design techniques for reliable, fault-tolerant, fail-safe and fail-soft systems; fault diagnosis and fault avoidance methods at program and system levels; experimental and commercial fault-tolerant computer systems.

Topic 4: Digital Systems Simulation: Uses and limitations of simulation algorithms for digital circuits and systems.

Topic 7: VLSI I: CMOS technology; structured digital circuits; VLSI systems; computer-aided design tools and theory for design automation; chip design.

Topic 8: VLSI II: Microelectronic systems architecture; VLSI circuit testing methods; integration of heterogeneous computer-aided design tools; wafer scale integration; advanced high-speed circuit design and integration.

Topic 9: Simulation Methods in CAD/VLSI: Techniques and algorithms for simulating large-scale digital and analog circuits.

Topic 10: Synthesis of Digital Systems: Automatic generation of gate-level implementations from HDL specifications; optimization of two-level, multilevel, and sequential circuits for area, speed, and testability.

Topic 11: Verification of Digital Systems: Automatic verification of digital systems; formal models and specifications, equivalence checking, design verification, temporal logic, BDDs, logical foundations, automata theory, recent developments.

Topic 12: System Design Metrics: Analysis of design at chip, board, and system levels; life cycle implications of design decisions, including design for testability effects on production and field service; economic and customer-driven factors.

Topic 13: Analysis and Design of Digital Integrated Circuits:

Topic 14: Analog Integrated Circuit Design:

Topic 15: Computer Performance Evaluation and Benchmarking: Performance metrics, benchmarks, measurement tools and techniques, simulation, trace generation, sampling, analytical modeling, workload characterization, statistical methods to compare alternatives, linear regression, and design of experiments.

Topic 16: Application-Specific Processing:

Topic 17: High-Level Synthesis of Digital Systems:

Topic 18: Java Processing: The Java run-time environment, Java Virtual Machine, processing Java in interpreted and JIT compilation modes, Java processors, Java benchmarks, characterization of Java workloads, performance impact of Java, optimizing microprocessors for Java.

Topic 19: Mixed-Signal System Design and Modeling:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: VLSI Testing: Hardware and software reliability analysis of digital systems; testing, design for testability, self-diagnosis, fault-tolerant logic design, error-detecting and error-correcting codes.

Topic 2: Dependable Computing: Design techniques for reliable, fault-tolerant, fail-safe and fail-soft systems; fault diagnosis and fault avoidance methods at program and system levels; experimental and commercial fault-tolerant computer systems.

Topic 4: Digital Systems Simulation: Uses and limitations of simulation algorithms for digital circuits and systems.

Topic 7: VLSI I: CMOS technology; structured digital circuits; VLSI systems; computer-aided design tools and theory for design automation; chip design.

Topic 8: VLSI II: Microelectronic systems architecture; VLSI circuit testing methods; integration of heterogeneous computer-aided design tools; wafer scale integration; advanced high-speed circuit design and integration.

Topic 9: Simulation Methods in CAD/VLSI: Techniques and algorithms for simulating large-scale digital and analog circuits.

Topic 10: Synthesis of Digital Systems: Automatic generation of gate-level implementations from HDL specifications; optimization of two-level, multilevel, and sequential circuits for area, speed, and testability.

Topic 11: Verification of Digital Systems: Automatic verification of digital systems; formal models and specifications, equivalence checking, design verification, temporal logic, BDDs, logical foundations, automata theory, recent developments.

Topic 12: System Design Metrics: Analysis of design at chip, board, and system levels; life cycle implications of design decisions, including design for testability effects on production and field service; economic and customer-driven factors.

Topic 13: Analysis and Design of Digital Integrated Circuits:

Topic 14: Analog Integrated Circuit Design:

Topic 15: Computer Performance Evaluation and Benchmarking: Performance metrics, benchmarks, measurement tools and techniques, simulation, trace generation, sampling, analytical modeling, workload characterization, statistical methods to compare alternatives, linear regression, and design of experiments.

Topic 16: Application-Specific Processing:

Topic 17: High-Level Synthesis of Digital Systems:

Topic 18: Java Processing: The Java run-time environment, Java Virtual Machine, processing Java in interpreted and JIT compilation modes, Java processors, Java benchmarks, characterization of Java workloads, performance impact of Java, optimizing microprocessors for Java.

Topic 19: Mixed-Signal System Design and Modeling:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: VLSI Testing: Hardware and software reliability analysis of digital systems; testing, design for testability, self-diagnosis, fault-tolerant logic design, error-detecting and error-correcting codes.

Topic 2: Dependable Computing: Design techniques for reliable, fault-tolerant, fail-safe and fail-soft systems; fault diagnosis and fault avoidance methods at program and system levels; experimental and commercial fault-tolerant computer systems.

Topic 4: Digital Systems Simulation: Uses and limitations of simulation algorithms for digital circuits and systems.

Topic 7: VLSI I: CMOS technology; structured digital circuits; VLSI systems; computer-aided design tools and theory for design automation; chip design.

Topic 8: VLSI II: Microelectronic systems architecture; VLSI circuit testing methods; integration of heterogeneous computer-aided design tools; wafer scale integration; advanced high-speed circuit design and integration.

Topic 9: Simulation Methods in CAD/VLSI: Techniques and algorithms for simulating large-scale digital and analog circuits.

Topic 10: Synthesis of Digital Systems: Automatic generation of gate-level implementations from HDL specifications; optimization of two-level, multilevel, and sequential circuits for area, speed, and testability.

Topic 11: Verification of Digital Systems: Automatic verification of digital systems; formal models and specifications, equivalence checking, design verification, temporal logic, BDDs, logical foundations, automata theory, recent developments.

Topic 12: System Design Metrics: Analysis of design at chip, board, and system levels; life cycle implications of design decisions, including design for testability effects on production and field service; economic and customer-driven factors.

Topic 13: Analysis and Design of Digital Integrated Circuits:

Topic 14: Analog Integrated Circuit Design:

Topic 15: Computer Performance Evaluation and Benchmarking: Performance metrics, benchmarks, measurement tools and techniques, simulation, trace generation, sampling, analytical modeling, workload characterization, statistical methods to compare alternatives, linear regression, and design of experiments.

Topic 16: Application-Specific Processing:

Topic 17: High-Level Synthesis of Digital Systems:

Topic 18: Java Processing: The Java run-time environment, Java Virtual Machine, processing Java in interpreted and JIT compilation modes, Java processors, Java benchmarks, characterization of Java workloads, performance impact of Java, optimizing microprocessors for Java.

Topic 19: Mixed-Signal System Design and Modeling:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: VLSI Testing: Hardware and software reliability analysis of digital systems; testing, design for testability, self-diagnosis, fault-tolerant logic design, error-detecting and error-correcting codes.

Topic 2: Dependable Computing: Design techniques for reliable, fault-tolerant, fail-safe and fail-soft systems; fault diagnosis and fault avoidance methods at program and system levels; experimental and commercial fault-tolerant computer systems.

Topic 4: Digital Systems Simulation: Uses and limitations of simulation algorithms for digital circuits and systems.

Topic 7: VLSI I: CMOS technology; structured digital circuits; VLSI systems; computer-aided design tools and theory for design automation; chip design.

Topic 8: VLSI II: Microelectronic systems architecture; VLSI circuit testing methods; integration of heterogeneous computer-aided design tools; wafer scale integration; advanced high-speed circuit design and integration.

Topic 9: Simulation Methods in CAD/VLSI: Techniques and algorithms for simulating large-scale digital and analog circuits.

Topic 10: Synthesis of Digital Systems: Automatic generation of gate-level implementations from HDL specifications; optimization of two-level, multilevel, and sequential circuits for area, speed, and testability.

Topic 11: Verification of Digital Systems: Automatic verification of digital systems; formal models and specifications, equivalence checking, design verification, temporal logic, BDDs, logical foundations, automata theory, recent developments.

Topic 12: System Design Metrics: Analysis of design at chip, board, and system levels; life cycle implications of design decisions, including design for testability effects on production and field service; economic and customer-driven factors.

Topic 13: Analysis and Design of Digital Integrated Circuits:

Topic 14: Analog Integrated Circuit Design:

Topic 15: Computer Performance Evaluation and Benchmarking: Performance metrics, benchmarks, measurement tools and techniques, simulation, trace generation, sampling, analytical modeling, workload characterization, statistical methods to compare alternatives, linear regression, and design of experiments.

Topic 16: Application-Specific Processing:

Topic 17: High-Level Synthesis of Digital Systems:

Topic 18: Java Processing: The Java run-time environment, Java Virtual Machine, processing Java in interpreted and JIT compilation modes, Java processors, Java benchmarks, characterization of Java workloads, performance impact of Java, optimizing microprocessors for Java.

Topic 19: Mixed-Signal System Design and Modeling:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 3: Interconnection Networks: Topologies, routing algorithms, permutations, resource allocations, performance evaluation, fault tolerance, VLSI design, parallel/distributed algorithms, languages for specifying protocols, distributed operating systems.

Topic 4: Advanced Embedded Microcontroller Systems: Hardware and software design of microcontroller systems; applications, including communication systems; object-oriented and operating systems approaches to interfacing and resource management.

Topic 5: Communication Networks: Technology, Architectures, and Protocols: Network services and techniques, layered architectures, circuit and packet-switching networks, internetworking, switch architectures, control mechanisms, and economic issues.

Topic 10: Parallel Computer Architecture: Study of parallel computing, including models, algorithms, languages, compilers, interconnection networks, and architectures.

Topic 11: Distributed Systems: Concurrent programming languages, distributed algorithms, distributed operating systems, distributed data, formal models of concurrency, protection and security in computer networks.

Topic 12: Discrete Event Systems: Models for discrete event systems, state machines, Petri nets, algebraic models, temporal logic, control of discrete event systems, observability, stability, simulation.

Topic 14: High-Speed Computer Arithmetic I: Design of computer arithmetic units: fast adders, fast multipliers, dividers, and floating-point arithmetic units.

Topic 15: High-Speed Computer Arithmetic II: Advanced topics in computer arithmetic, including error correcting coding, residue number systems, CORDIC arithmetic, and VLSI implementation. Additional prerequisite: Electrical Engineering 382N (Topic 14).

Topic 16: Distributed Information System Security:

Topic 17: Superscalar Microprocessor Architectures: Superscalar processor architectures, comparison with VLIW processors, program parallelism, performance evaluation, trace generation, memory systems, branch prediction.

Topic 18: Distributed Systems II:

Topic 19: Microarchitecture:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 3: Interconnection Networks: Topologies, routing algorithms, permutations, resource allocations, performance evaluation, fault tolerance, VLSI design, parallel/distributed algorithms, languages for specifying protocols, distributed operating systems.

Topic 4: Advanced Embedded Microcontroller Systems: Hardware and software design of microcontroller systems; applications, including communication systems; object-oriented and operating systems approaches to interfacing and resource management.

Topic 5: Communication Networks: Technology, Architectures, and Protocols: Network services and techniques, layered architectures, circuit and packet-switching networks, internetworking, switch architectures, control mechanisms, and economic issues.

Topic 10: Parallel Computer Architecture: Study of parallel computing, including models, algorithms, languages, compilers, interconnection networks, and architectures.

Topic 11: Distributed Systems: Concurrent programming languages, distributed algorithms, distributed operating systems, distributed data, formal models of concurrency, protection and security in computer networks.

Topic 12: Discrete Event Systems: Models for discrete event systems, state machines, Petri nets, algebraic models, temporal logic, control of discrete event systems, observability, stability, simulation.

Topic 14: High-Speed Computer Arithmetic I: Design of computer arithmetic units: fast adders, fast multipliers, dividers, and floating-point arithmetic units.

Topic 15: High-Speed Computer Arithmetic II: Advanced topics in computer arithmetic, including error correcting coding, residue number systems, CORDIC arithmetic, and VLSI implementation. Additional prerequisite: Electrical Engineering 382N (Topic 14).

Topic 16: Distributed Information System Security:

Topic 17: Superscalar Microprocessor Architectures: Superscalar processor architectures, comparison with VLIW processors, program parallelism, performance evaluation, trace generation, memory systems, branch prediction.

Topic 18: Distributed Systems II:

Topic 19: Microarchitecture:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 3: Interconnection Networks: Topologies, routing algorithms, permutations, resource allocations, performance evaluation, fault tolerance, VLSI design, parallel/distributed algorithms, languages for specifying protocols, distributed operating systems.

Topic 4: Advanced Embedded Microcontroller Systems: Hardware and software design of microcontroller systems; applications, including communication systems; object-oriented and operating systems approaches to interfacing and resource management.

Topic 5: Communication Networks: Technology, Architectures, and Protocols: Network services and techniques, layered architectures, circuit and packet-switching networks, internetworking, switch architectures, control mechanisms, and economic issues.

Topic 10: Parallel Computer Architecture: Study of parallel computing, including models, algorithms, languages, compilers, interconnection networks, and architectures.

Topic 11: Distributed Systems: Concurrent programming languages, distributed algorithms, distributed operating systems, distributed data, formal models of concurrency, protection and security in computer networks.

Topic 12: Discrete Event Systems: Models for discrete event systems, state machines, Petri nets, algebraic models, temporal logic, control of discrete event systems, observability, stability, simulation.

Topic 14: High-Speed Computer Arithmetic I: Design of computer arithmetic units: fast adders, fast multipliers, dividers, and floating-point arithmetic units.

Topic 15: High-Speed Computer Arithmetic II: Advanced topics in computer arithmetic, including error correcting coding, residue number systems, CORDIC arithmetic, and VLSI implementation. Additional prerequisite: Electrical Engineering 382N (Topic 14).

Topic 16: Distributed Information System Security:

Topic 17: Superscalar Microprocessor Architectures: Superscalar processor architectures, comparison with VLIW processors, program parallelism, performance evaluation, trace generation, memory systems, branch prediction.

Topic 18: Distributed Systems II:

Topic 19: Microarchitecture:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 3: Interconnection Networks: Topologies, routing algorithms, permutations, resource allocations, performance evaluation, fault tolerance, VLSI design, parallel/distributed algorithms, languages for specifying protocols, distributed operating systems.

Topic 4: Advanced Embedded Microcontroller Systems: Hardware and software design of microcontroller systems; applications, including communication systems; object-oriented and operating systems approaches to interfacing and resource management.

Topic 5: Communication Networks: Technology, Architectures, and Protocols: Network services and techniques, layered architectures, circuit and packet-switching networks, internetworking, switch architectures, control mechanisms, and economic issues.

Topic 10: Parallel Computer Architecture: Study of parallel computing, including models, algorithms, languages, compilers, interconnection networks, and architectures.

Topic 11: Distributed Systems: Concurrent programming languages, distributed algorithms, distributed operating systems, distributed data, formal models of concurrency, protection and security in computer networks.

Topic 12: Discrete Event Systems: Models for discrete event systems, state machines, Petri nets, algebraic models, temporal logic, control of discrete event systems, observability, stability, simulation.

Topic 14: High-Speed Computer Arithmetic I: Design of computer arithmetic units: fast adders, fast multipliers, dividers, and floating-point arithmetic units.

Topic 15: High-Speed Computer Arithmetic II: Advanced topics in computer arithmetic, including error correcting coding, residue number systems, CORDIC arithmetic, and VLSI implementation. Additional prerequisite: Electrical Engineering 382N (Topic 14).

Topic 16: Distributed Information System Security:

Topic 17: Superscalar Microprocessor Architectures: Superscalar processor architectures, comparison with VLIW processors, program parallelism, performance evaluation, trace generation, memory systems, branch prediction.

Topic 18: Distributed Systems II:

Topic 19: Microarchitecture:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 3: Interconnection Networks: Topologies, routing algorithms, permutations, resource allocations, performance evaluation, fault tolerance, VLSI design, parallel/distributed algorithms, languages for specifying protocols, distributed operating systems.

Topic 4: Advanced Embedded Microcontroller Systems: Hardware and software design of microcontroller systems; applications, including communication systems; object-oriented and operating systems approaches to interfacing and resource management.

Topic 5: Communication Networks: Technology, Architectures, and Protocols: Network services and techniques, layered architectures, circuit and packet-switching networks, internetworking, switch architectures, control mechanisms, and economic issues.

Topic 10: Parallel Computer Architecture: Study of parallel computing, including models, algorithms, languages, compilers, interconnection networks, and architectures.

Topic 11: Distributed Systems: Concurrent programming languages, distributed algorithms, distributed operating systems, distributed data, formal models of concurrency, protection and security in computer networks.

Topic 12: Discrete Event Systems: Models for discrete event systems, state machines, Petri nets, algebraic models, temporal logic, control of discrete event systems, observability, stability, simulation.

Topic 14: High-Speed Computer Arithmetic I: Design of computer arithmetic units: fast adders, fast multipliers, dividers, and floating-point arithmetic units.

Topic 15: High-Speed Computer Arithmetic II: Advanced topics in computer arithmetic, including error correcting coding, residue number systems, CORDIC arithmetic, and VLSI implementation. Additional prerequisite: Electrical Engineering 382N (Topic 14).

Topic 16: Distributed Information System Security:

Topic 17: Superscalar Microprocessor Architectures: Superscalar processor architectures, comparison with VLIW processors, program parallelism, performance evaluation, trace generation, memory systems, branch prediction.

Topic 18: Distributed Systems II:

Topic 19: Microarchitecture:

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 3: Interconnection Networks: Topologies, routing algorithms, permutations, resource allocations, performance evaluation, fault tolerance, VLSI design, parallel/distributed algorithms, languages for specifying protocols, distributed operating systems.

Topic 4: Advanced Embedded Microcontroller Systems: Hardware and software design of microcontroller systems; applications, including communication systems; object-oriented and operating systems approaches to interfacing and resource management.

Topic 5: Communication Networks: Technology, Architectures, and Protocols: Network services and techniques, layered architectures, circuit and packet-switching networks, internetworking, switch architectures, control mechanisms, and economic issues.

Topic 10: Parallel Computer Architecture: Study of parallel computing, including models, algorithms, languages, compilers, interconnection networks, and architectures.

Topic 11: Distributed Systems: Concurrent programming languages, distributed algorithms, distributed operating systems, distributed data, formal models of concurrency, protection and security in computer networks.

Topic 12: Discrete Event Systems: Models for discrete event systems, state machines, Petri nets, algebraic models, temporal logic, control of discrete event systems, observability, stability, simulation.

Topic 14: High-Speed Computer Arithmetic I: Design of computer arithmetic units: fast adders, fast multipliers, dividers, and floating-point arithmetic units.

Topic 15: High-Speed Computer Arithmetic II: Advanced topics in computer arithmetic, including error correcting coding, residue number systems, CORDIC arithmetic, and VLSI implementation. Additional prerequisite: Electrical Engineering 382N (Topic 14).

Topic 16: Distributed Information System Security:

Topic 17: Superscalar Microprocessor Architectures: Superscalar processor architectures, comparison with VLIW processors, program parallelism, performance evaluation, trace generation, memory systems, branch prediction.

Topic 18: Distributed Systems II:

Topic 19: Microarchitecture:

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Vector space, Green's function; equivalence theorem; vector potentials; plane, cylindrical, and spherical waves; radiation and scattering. Prerequisite: Graduate standing in electrical engineering, or graduate standing and consent of instructor.

Intermediate electromagnetic field theory, with emphasis on the interaction of fields and material media, including anisotropic media. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Acoustics I: Same as Mechanical Engineering 384N (Topic 1: Acoustics). Plane waves in fluids; transient and steady-state reflection and transmission; lumped elements; refraction; strings, membranes, and rooms; horns; ray acoustics; absorption and dispersion.

Topic 2: Acoustics II: Same as Mechanical Engineering 384N (Topic 2: Acoustics II). Rigorous derivation of acoustic wave equation; spherical and cylindrical waves; source theory; vibrating piston; enclosures; waveguides; arrays; diffraction. Additional prerequisite: Electrical Engineering 384N (Topic 1) or Mechanical Engineering 384N (Topic 1: Acoustics I).

Topic 3: Electromechanical Transducers: Same as Mechanical Engineering 384N (Topic 3: Electromechanical Transducers). Electrical, mechanical, and acoustical dynamics; principles of energy conversion, transducer laws, and representation; effects of the transducer characteristics on accuracy and efficiency of energy transformation. Biomedical Engineering 384N (Topic 3: Electromechanical Sensors/Actuators) and Electrical Engineering 384N (Topic 3) may not both be counted.

Topic 4: Nonlinear Acoustics: Same as Mechnical Engineering 384N (Topic 4: Nonlinear Acoustics). Distortion and shock formation in finite amplitude waves; harmonic generation and spectral interactions; absorption and dispersion; radiation pressure; acoustic streaming; weak shock theory; numerical modeling; diffraction of intense sound beams; parametric arrays.

Topic 5: Underwater Acoustics: Same as Mechanical Engineering 384N (Topic 5: Underwater Acoustics). Acoustical properties of the ocean; point sources and Green's functions; reflection phenomena; ray theory; normal mode theory; guided waves in horizontally stratified fluid media; WKB and parabolic approximations. Additional prerequisite: Electrical Engineering 384N (Topic 1), Mechanical Engineering 384N (Topic 1: Acoustics I), or consent of instructor.

Topic 6: Noise Control: Same as Mechanical Engineering 384N (Topic 6: Noise Control). Acoustic modeling techniques; panel radiation theory; absorption, barrier, and enclosure design; diagnosis based on experimental data.

Topic 7: Ultrasonics: Same as Mechanical Engineering 384N (Topic 7: Ultrasonics). Acoustic wave propagation in liquids and solids and at interfaces; transducers, arrays; imaging and sonar systems. Biomedical Engineering 384N (Topic 7: Ultrasonics) and Electrical Engineering 384N (Topic 7) may not both be counted.

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Acoustics I: Same as Mechanical Engineering 384N (Topic 1: Acoustics). Plane waves in fluids; transient and steady-state reflection and transmission; lumped elements; refraction; strings, membranes, and rooms; horns; ray acoustics; absorption and dispersion.

Topic 2: Acoustics II: Same as Mechanical Engineering 384N (Topic 2: Acoustics II). Rigorous derivation of acoustic wave equation; spherical and cylindrical waves; source theory; vibrating piston; enclosures; waveguides; arrays; diffraction. Additional prerequisite: Electrical Engineering 384N (Topic 1) or Mechanical Engineering 384N (Topic 1: Acoustics I).

Topic 3: Electromechanical Transducers: Same as Mechanical Engineering 384N (Topic 3: Electromechanical Transducers). Electrical, mechanical, and acoustical dynamics; principles of energy conversion, transducer laws, and representation; effects of the transducer characteristics on accuracy and efficiency of energy transformation. Biomedical Engineering 384N (Topic 3: Electromechanical Sensors/Actuators) and Electrical Engineering 384N (Topic 3) may not both be counted.

Topic 4: Nonlinear Acoustics: Same as Mechnical Engineering 384N (Topic 4: Nonlinear Acoustics). Distortion and shock formation in finite amplitude waves; harmonic generation and spectral interactions; absorption and dispersion; radiation pressure; acoustic streaming; weak shock theory; numerical modeling; diffraction of intense sound beams; parametric arrays.

Topic 5: Underwater Acoustics: Same as Mechanical Engineering 384N (Topic 5: Underwater Acoustics). Acoustical properties of the ocean; point sources and Green's functions; reflection phenomena; ray theory; normal mode theory; guided waves in horizontally stratified fluid media; WKB and parabolic approximations. Additional prerequisite: Electrical Engineering 384N (Topic 1), Mechanical Engineering 384N (Topic 1: Acoustics I), or consent of instructor.

Topic 6: Noise Control: Same as Mechanical Engineering 384N (Topic 6: Noise Control). Acoustic modeling techniques; panel radiation theory; absorption, barrier, and enclosure design; diagnosis based on experimental data.

Topic 7: Ultrasonics: Same as Mechanical Engineering 384N (Topic 7: Ultrasonics). Acoustic wave propagation in liquids and solids and at interfaces; transducers, arrays; imaging and sonar systems. Biomedical Engineering 384N (Topic 7: Ultrasonics) and Electrical Engineering 384N (Topic 7) may not both be counted.

May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Acoustics I: Same as Mechanical Engineering 384N (Topic 1: Acoustics). Plane waves in fluids; transient and steady-state reflection and transmission; lumped elements; refraction; strings, membranes, and rooms; horns; ray acoustics; absorption and dispersion.

Topic 2: Acoustics II: Same as Mechanical Engineering 384N (Topic 2: Acoustics II). Rigorous derivation of acoustic wave equation; spherical and cylindrical waves; source theory; vibrating piston; enclosures; waveguides; arrays; diffraction. Additional prerequisite: Electrical Engineering 384N (Topic 1) or Mechanical Engineering 384N (Topic 1: Acoustics I).

Topic 3: Electromechanical Transducers: Same as Mechanical Engineering 384N (Topic 3: Electromechanical Transducers). Electrical, mechanical, and acoustical dynamics; principles of energy conversion, transducer laws, and representation; effects of the transducer characteristics on accuracy and efficiency of energy transformation. Biomedical Engineering 384N (Topic 3: Electromechanical Sensors/Actuators) and Electrical Engineering 384N (Topic 3) may not both be counted.

Topic 4: Nonlinear Acoustics: Same as Mechnical Engineering 384N (Topic 4: Nonlinear Acoustics). Distortion and shock formation in finite amplitude waves; harmonic generation and spectral interactions; absorption and dispersion; radiation pressure; acoustic streaming; weak shock theory; numerical modeling; diffraction of intense sound beams; parametric arrays.

Topic 5: Underwater Acoustics: Same as Mechanical Engineering 384N (Topic 5: Underwater Acoustics). Acoustical properties of the ocean; point sources and Green's functions; reflection phenomena; ray theory; normal mode theory; guided waves in horizontally stratified fluid media; WKB and parabolic approximations. Additional prerequisite: Electrical Engineering 384N (Topic 1), Mechanical Engineering 384N (Topic 1: Acoustics I), or consent of instructor.

Topic 6: Noise Control: Same as Mechanical Engineering 384N (Topic 6: Noise Control). Acoustic modeling techniques; panel radiation theory; absorption, barrier, and enclosure design; diagnosis based on experimental data.

Topic 7: Ultrasonics: Same as Mechanical Engineering 384N (Topic 7: Ultrasonics). Acoustic wave propagation in liquids and solids and at interfaces; transducers, arrays; imaging and sonar systems. Biomedical Engineering 384N (Topic 7: Ultrasonics) and Electrical Engineering 384N (Topic 7) may not both be counted.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing in engineering and consent of instructor.

Topic 3: Bioelectric Phenomena: Same as Biomedical Engineering 384J (Topic 4: Bioelectric Phenomena). Examines the physiological bases of bioelectricity and the techniques required to record bioelectric phenomena both intracellularly and extracellularly; the representation of bioelectric activity by equivalent dipoles and the volume conductor fields produced.

Topic 9: Laser-Tissue Interaction: Thermal: Same as Biomedical Engineering 381J (Topic 1: Laser-Tissue Interaction: Thermal). The thermal response of random media in interaction with laser irradiation. Calculation of the rate of heat production caused by direct absorption of the laser light, thermal damage, and ablation.

Topic 15: Biosignal Analysis: Same as Biomedical Engineering 384J (Topic 3: Biosignal Analysis). Theory and classification of biological signals such as EEG, EKG, and EMG. Data acquisition and analysis procedures for biological signals, including computer applications.

Topic 16: Laser-Tissue Interaction: Optical: Same as Biomedical Engineering 381J (Topic 2: Laser-Tissue Interaction: Optical). The optical behavior of random media such as tissue in interaction with laser irradiation. Approximate transport equation methods to predict the absorption and scattering parameters of laser light inside tissue. Port-wine stain treatment; cancer treatment by photochemotherapy; and cardiovascular applications.

Topic 17: Biomedical Instrumentation II: Real-Time Computer-Based Systems: Same as Biomedical Engineering 384J (Topic 2: Biomedical Instrumentation II: Real-Time Computer-Based Systems). Design, testing, patient safety, electrical noise, biomedical measurement transducers, therapeutics, instrumentation electronics, microcomputer interfaces, and embedded systems. Four structured laboratories and an individual project laboratory.

Topic 18: Biomedical Imaging: Signals and Systems: Same as Biomedical Engineering 381J (Topic 3: Biomedical Imaging: Signals and Systems). Physical principles and signal processing techniques used in thermographic, ultrasonic, and radiographic imaging, including image reconstruction from projections such as CT scanning, MRI, and millimeter wave determination of temperature profiles. Additional prerequisite: Electrical Engineering 371R.

Topic 23: Optical Spectroscopy: Same as Biomedical Engineering 381J (Topic 4: Optical Spectroscopy). Measurement and interpretation of spectra: steady-state and time-resolved absorption, fluorescence, phosphorescence, and Raman spectroscopy in the ultraviolet, visible, and infrared portions of the spectrum.

Topic 26: Therapeutic Heating: Same as Biomedical Engineering 381J (Topic 5: Therapeutic Heating). Engineering aspects of electromagnetic fields that have therapeutic applications: diathermy (short wave, microwave, and ultrasound), electrosurgery (thermal damage processes), stimulation of excitable tissue, and electrical safety.

Topic 28: Noninvasive Optical Tomography: Same as Biomedical Engineering 381J (Topic 6: Noninvasive Optical Tomography). Basic principles of optical tomographic imaging of biological materials for diagnostic or therapeutic applications. Optical-based tomographic imaging techniques including photothermal, photoacoustic, and coherent methodologies.

Topic 31: Biomedical Instrumentation I: Same as Biomedical Engineering 384J (Topic 1: Biomedical Instrumentation I). Application of electrical engineering techniques to analysis and instrumentation in biological sciences: pressure, flow, temperature measurement; bioelectrical signals; pacemakers; ultrasonics; electrical safety; electrotherapeutics.

Topic 32: Projects in Biomedical Engineering: Same as Biomedical Engineering 384J (Topic 5: Projects in Biomedical Engineering). An in-depth examination of selected topics, such as optical and thermal properties of laser interaction with tissue; measurement of perfusion in the microvascular system; diagnostic imaging; interaction of living systems with electromagnetic fields; robotic surgical tools; ophthalmic instrumentation; noninvasive cardiovascular measurements. Three lecture hours and six laboratory hours a week for one semester. Additional prerequisite: Electrical Engineering 385J (Topic 31).

Topic 33: Neurophysiology/Prosthesis Design: Same as Biomedical Engineering 384J (Topic 6: Neurophysiology/Prosthesis Design). The structure and function of the human brain. Discussion of selected neurological diseases in conjunction with normal neurophysiology. Study of neuroprosthesis treatments and design philosophy, functional neural stimulation, and functional muscular stimulation.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Steady-state and transient analysis; symmetrical components, stability, protection, relaying. May be repeated for credit when the topics vary. Prerequisite: Graduate standing in electrical engineering, or graduate standing and consent of instructor.

Topic 1: Power System Instrumentation and Control: Study of control functions related to energy control centers and to power plant control.

Topic 3: Advanced Apparatus Design Topics: Study of unconventional machinery; power electronic drive systems for machines.

Topic 4: Economic Operation of Power Systems: Advanced techniques for operating power systems in the most economic manner while meeting various network constraints; economic dispatch, penalty factors, optimal power flow.

Topic 5: Power System Dynamics and Stability: Computer methods for solving and predicting the behavior of networks during short-term and long-term disturbances.

Topic 6: Advanced Electric Machinery: Detailed modeling and design of large induction and synchronous machines.

Topic 7: Power Electronic Devices and Systems: A study of power electronic components and circuits; HVDC converters; electronic drives for machines; AC/DC converters.

Topic 8: Power Transmission and Distribution Topics: Calculation of electric fields, standing waves, audible noise, corona, and high voltage effects.

Topic 9: Power Quality: The study of electrical transients, switching surges, lightning, and other phenomena that cause deviations in 60-hertz sinusoidal voltages and currents.

Topic 10: Electromechanical Dynamics: Same as Mechanical Engineering 384E (Topic 1: Electromechanical Dynamics). Maxwell's equations and transient response of electrical machines.

Topic 11: Design of Electrical Machines: Same as Mechanical Engineering 384E (Topic 2: Design of Electrical Machines). Electrical and mechanical design of electrical machines.

Topic 12: Open-Access Transmission: Terms and conditions, pricing methodologies, independent system operators, ancillary services, auctions and bid strategies, losses and allocation policies.

Topic 13: Intelligent Motion for Robotics and Control:

Topic 14: Electrical Transients in Power Systems: Analysis and modeling of electrical transient phenomena in power systems, traveling wave, insulation coordination, overvoltage protection.

Steady-state and transient analysis; symmetrical components, stability, protection, relaying. May be repeated for credit when the topics vary. Prerequisite: Graduate standing in electrical engineering, or graduate standing and consent of instructor.

Topic 1: Power System Instrumentation and Control: Study of control functions related to energy control centers and to power plant control.

Topic 3: Advanced Apparatus Design Topics: Study of unconventional machinery; power electronic drive systems for machines.

Topic 4: Economic Operation of Power Systems: Advanced techniques for operating power systems in the most economic manner while meeting various network constraints; economic dispatch, penalty factors, optimal power flow.

Topic 5: Power System Dynamics and Stability: Computer methods for solving and predicting the behavior of networks during short-term and long-term disturbances.

Topic 6: Advanced Electric Machinery: Detailed modeling and design of large induction and synchronous machines.

Topic 7: Power Electronic Devices and Systems: A study of power electronic components and circuits; HVDC converters; electronic drives for machines; AC/DC converters.

Topic 8: Power Transmission and Distribution Topics: Calculation of electric fields, standing waves, audible noise, corona, and high voltage effects.

Topic 9: Power Quality: The study of electrical transients, switching surges, lightning, and other phenomena that cause deviations in 60-hertz sinusoidal voltages and currents.

Topic 10: Electromechanical Dynamics: Same as Mechanical Engineering 384E (Topic 1: Electromechanical Dynamics). Maxwell's equations and transient response of electrical machines.

Topic 11: Design of Electrical Machines: Same as Mechanical Engineering 384E (Topic 2: Design of Electrical Machines). Electrical and mechanical design of electrical machines.

Topic 12: Open-Access Transmission: Terms and conditions, pricing methodologies, independent system operators, ancillary services, auctions and bid strategies, losses and allocation policies.

Topic 13: Intelligent Motion for Robotics and Control:

Topic 14: Electrical Transients in Power Systems: Analysis and modeling of electrical transient phenomena in power systems, traveling wave, insulation coordination, overvoltage protection.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Theory of electron, magnetic, and electro-optic devices. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Metal Oxide Semiconductor Devices: Physics and Technology:

Topic 2: Semiconductor Physics: Introduction to the fundamental physics of charge carrier states in semiconductors, charge carrier interactions among themselves and with the environment, and charge transport in semiconductors and their heterostructures. Additional prerequisite: An introductory course in quantum mechanics.

Topic 4: Synthesis, Growth, and Analysis of Electronic Materials:

Topic 5: Superconducting Electronic Devices:

Topic 6: Magnetic Phenomena in Materials:

Topic 7: MOS Integrated Circuit Process Integration:

Topic 8: VLSI Fabrication Techniques:

Topic 9: Localized versus Itinerant Electrons in Solids: Same as Mechanical Engineering 386R (Topic 1: Localized versus Itinerant Electrons in Solids). Description of electrons, from free atoms to crystals; band theory contrasted with crystal-field theory; evolution of electronic properties on passing from magnetic insulators to normal metals, from ionic to covalent solids, from single-valent compounds to mixed-valent systems; electron-lattice interactions and phase transitions; many examples. Additional prerequisite: A semester of quantum mechanics and a semester of solid-state science or technology.

Topic 10: Ionic Conductors: Same as Mechanical Engineering 386T (Topic 1: Ionic Conductors).

Topic 11: High-Temperature Superconductors: Same as Mechanical Engineering 386T (Topic 2: High-Temperature Superconductors).

Topic 12: Catalytic Electrodes: Same as Mechanical Engineering 386T (Topic 3: Catalytic Electrodes).

Topic 13: Magnetic Materials: Same as Mechanical Engineering 386T (Topic 4: Magnetic Materials).

Topic 14: Optical Interconnects:

Topic 15: Optoelectronics Integrated Circuits:

Topic 16: Semiconductor Lasers:

Topic 17: Localized-Electron Phenomena: Same as Mechanical Engineering 386R (Topic 2: Localized-Electron Phenomena). Analysis of the variation in physical properties versus chemical composition of several groups of isostructural transition-metal compounds. Additional prerequisite: A semester of solid-state science and/or quantum mechanics.

Topic 19: Plasma Processing of Semiconductors I: Plasma analysis using Boltzmann and fluid equations; plasma properties, including Debye length, quasineutrality, and sheaths; basic collisional properties, including Coulomb and polarization scattering; analysis of capacitive and wave-heated plasma processing reactors.

Topic 20: Plasma Processing of Semiconductors II: Plasma chemistry and equilibrium; analysis of molecular collisions; chemical kinetics and surface processes; plasma discharge particle and energy balance; analysis of inductive and DC plasma processing reactors; plasma etching, deposition, and implantation.

Topic 21: Submicron Device Physics and Techniques:

Topic 22: Semiconductor Microlithography:

Topic 23: Semiconductor Heterostructures:

Topic 24: Microwave Devices:

Topic 25: Organic and Polymer Semiconductor Devices:

Topic 26: Microelectromechanical Systems:

Topic 27: Charge Transport in Organic Semiconductors:

Theory of electron, magnetic, and electro-optic devices. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Metal Oxide Semiconductor Devices: Physics and Technology:

Topic 2: Semiconductor Physics: Introduction to the fundamental physics of charge carrier states in semiconductors, charge carrier interactions among themselves and with the environment, and charge transport in semiconductors and their heterostructures. Additional prerequisite: An introductory course in quantum mechanics.

Topic 4: Synthesis, Growth, and Analysis of Electronic Materials:

Topic 5: Superconducting Electronic Devices:

Topic 6: Magnetic Phenomena in Materials:

Topic 7: MOS Integrated Circuit Process Integration:

Topic 8: VLSI Fabrication Techniques:

Topic 9: Localized versus Itinerant Electrons in Solids: Same as Mechanical Engineering 386R (Topic 1: Localized versus Itinerant Electrons in Solids). Description of electrons, from free atoms to crystals; band theory contrasted with crystal-field theory; evolution of electronic properties on passing from magnetic insulators to normal metals, from ionic to covalent solids, from single-valent compounds to mixed-valent systems; electron-lattice interactions and phase transitions; many examples. Additional prerequisite: A semester of quantum mechanics and a semester of solid-state science or technology.

Topic 10: Ionic Conductors: Same as Mechanical Engineering 386T (Topic 1: Ionic Conductors).

Topic 11: High-Temperature Superconductors: Same as Mechanical Engineering 386T (Topic 2: High-Temperature Superconductors).

Topic 12: Catalytic Electrodes: Same as Mechanical Engineering 386T (Topic 3: Catalytic Electrodes).

Topic 13: Magnetic Materials: Same as Mechanical Engineering 386T (Topic 4: Magnetic Materials).

Topic 14: Optical Interconnects:

Topic 15: Optoelectronics Integrated Circuits:

Topic 16: Semiconductor Lasers:

Topic 17: Localized-Electron Phenomena: Same as Mechanical Engineering 386R (Topic 2: Localized-Electron Phenomena). Analysis of the variation in physical properties versus chemical composition of several groups of isostructural transition-metal compounds. Additional prerequisite: A semester of solid-state science and/or quantum mechanics.

Topic 19: Plasma Processing of Semiconductors I: Plasma analysis using Boltzmann and fluid equations; plasma properties, including Debye length, quasineutrality, and sheaths; basic collisional properties, including Coulomb and polarization scattering; analysis of capacitive and wave-heated plasma processing reactors.

Topic 20: Plasma Processing of Semiconductors II: Plasma chemistry and equilibrium; analysis of molecular collisions; chemical kinetics and surface processes; plasma discharge particle and energy balance; analysis of inductive and DC plasma processing reactors; plasma etching, deposition, and implantation.

Topic 21: Submicron Device Physics and Techniques:

Topic 22: Semiconductor Microlithography:

Topic 23: Semiconductor Heterostructures:

Topic 24: Microwave Devices:

Topic 25: Organic and Polymer Semiconductor Devices:

Topic 26: Microelectromechanical Systems:

Topic 27: Charge Transport in Organic Semiconductors:

Theory of electron, magnetic, and electro-optic devices. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Metal Oxide Semiconductor Devices: Physics and Technology:

Topic 2: Semiconductor Physics: Introduction to the fundamental physics of charge carrier states in semiconductors, charge carrier interactions among themselves and with the environment, and charge transport in semiconductors and their heterostructures. Additional prerequisite: An introductory course in quantum mechanics.

Topic 4: Synthesis, Growth, and Analysis of Electronic Materials:

Topic 5: Superconducting Electronic Devices:

Topic 6: Magnetic Phenomena in Materials:

Topic 7: MOS Integrated Circuit Process Integration:

Topic 8: VLSI Fabrication Techniques:

Topic 9: Localized versus Itinerant Electrons in Solids: Same as Mechanical Engineering 386R (Topic 1: Localized versus Itinerant Electrons in Solids). Description of electrons, from free atoms to crystals; band theory contrasted with crystal-field theory; evolution of electronic properties on passing from magnetic insulators to normal metals, from ionic to covalent solids, from single-valent compounds to mixed-valent systems; electron-lattice interactions and phase transitions; many examples. Additional prerequisite: A semester of quantum mechanics and a semester of solid-state science or technology.

Topic 10: Ionic Conductors: Same as Mechanical Engineering 386T (Topic 1: Ionic Conductors).

Topic 11: High-Temperature Superconductors: Same as Mechanical Engineering 386T (Topic 2: High-Temperature Superconductors).

Topic 12: Catalytic Electrodes: Same as Mechanical Engineering 386T (Topic 3: Catalytic Electrodes).

Topic 13: Magnetic Materials: Same as Mechanical Engineering 386T (Topic 4: Magnetic Materials).

Topic 14: Optical Interconnects:

Topic 15: Optoelectronics Integrated Circuits:

Topic 16: Semiconductor Lasers:

Topic 17: Localized-Electron Phenomena: Same as Mechanical Engineering 386R (Topic 2: Localized-Electron Phenomena). Analysis of the variation in physical properties versus chemical composition of several groups of isostructural transition-metal compounds. Additional prerequisite: A semester of solid-state science and/or quantum mechanics.

Topic 19: Plasma Processing of Semiconductors I: Plasma analysis using Boltzmann and fluid equations; plasma properties, including Debye length, quasineutrality, and sheaths; basic collisional properties, including Coulomb and polarization scattering; analysis of capacitive and wave-heated plasma processing reactors.

Topic 20: Plasma Processing of Semiconductors II: Plasma chemistry and equilibrium; analysis of molecular collisions; chemical kinetics and surface processes; plasma discharge particle and energy balance; analysis of inductive and DC plasma processing reactors; plasma etching, deposition, and implantation.

Topic 21: Submicron Device Physics and Techniques:

Topic 22: Semiconductor Microlithography:

Topic 23: Semiconductor Heterostructures:

Topic 24: Microwave Devices:

Topic 25: Organic and Polymer Semiconductor Devices:

Topic 26: Microelectromechanical Systems:

Topic 27: Charge Transport in Organic Semiconductors:

Theory of electron, magnetic, and electro-optic devices. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Metal Oxide Semiconductor Devices: Physics and Technology:

Topic 2: Semiconductor Physics: Introduction to the fundamental physics of charge carrier states in semiconductors, charge carrier interactions among themselves and with the environment, and charge transport in semiconductors and their heterostructures. Additional prerequisite: An introductory course in quantum mechanics.

Topic 4: Synthesis, Growth, and Analysis of Electronic Materials:

Topic 5: Superconducting Electronic Devices:

Topic 6: Magnetic Phenomena in Materials:

Topic 7: MOS Integrated Circuit Process Integration:

Topic 8: VLSI Fabrication Techniques:

Topic 9: Localized versus Itinerant Electrons in Solids: Same as Mechanical Engineering 386R (Topic 1: Localized versus Itinerant Electrons in Solids). Description of electrons, from free atoms to crystals; band theory contrasted with crystal-field theory; evolution of electronic properties on passing from magnetic insulators to normal metals, from ionic to covalent solids, from single-valent compounds to mixed-valent systems; electron-lattice interactions and phase transitions; many examples. Additional prerequisite: A semester of quantum mechanics and a semester of solid-state science or technology.

Topic 10: Ionic Conductors: Same as Mechanical Engineering 386T (Topic 1: Ionic Conductors).

Topic 11: High-Temperature Superconductors: Same as Mechanical Engineering 386T (Topic 2: High-Temperature Superconductors).

Topic 12: Catalytic Electrodes: Same as Mechanical Engineering 386T (Topic 3: Catalytic Electrodes).

Topic 13: Magnetic Materials: Same as Mechanical Engineering 386T (Topic 4: Magnetic Materials).

Topic 14: Optical Interconnects:

Topic 15: Optoelectronics Integrated Circuits:

Topic 16: Semiconductor Lasers:

Topic 17: Localized-Electron Phenomena: Same as Mechanical Engineering 386R (Topic 2: Localized-Electron Phenomena). Analysis of the variation in physical properties versus chemical composition of several groups of isostructural transition-metal compounds. Additional prerequisite: A semester of solid-state science and/or quantum mechanics.

Topic 19: Plasma Processing of Semiconductors I: Plasma analysis using Boltzmann and fluid equations; plasma properties, including Debye length, quasineutrality, and sheaths; basic collisional properties, including Coulomb and polarization scattering; analysis of capacitive and wave-heated plasma processing reactors.

Topic 20: Plasma Processing of Semiconductors II: Plasma chemistry and equilibrium; analysis of molecular collisions; chemical kinetics and surface processes; plasma discharge particle and energy balance; analysis of inductive and DC plasma processing reactors; plasma etching, deposition, and implantation.

Topic 21: Submicron Device Physics and Techniques:

Topic 22: Semiconductor Microlithography:

Topic 23: Semiconductor Heterostructures:

Topic 24: Microwave Devices:

Topic 25: Organic and Polymer Semiconductor Devices:

Topic 26: Microelectromechanical Systems:

Topic 27: Charge Transport in Organic Semiconductors:

Theory of electron, magnetic, and electro-optic devices. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Topic 1: Metal Oxide Semiconductor Devices: Physics and Technology:

Topic 2: Semiconductor Physics: Introduction to the fundamental physics of charge carrier states in semiconductors, charge carrier interactions among themselves and with the environment, and charge transport in semiconductors and their heterostructures. Additional prerequisite: An introductory course in quantum mechanics.

Topic 4: Synthesis, Growth, and Analysis of Electronic Materials:

Topic 5: Superconducting Electronic Devices:

Topic 6: Magnetic Phenomena in Materials:

Topic 7: MOS Integrated Circuit Process Integration:

Topic 8: VLSI Fabrication Techniques:

Topic 9: Localized versus Itinerant Electrons in Solids: Same as Mechanical Engineering 386R (Topic 1: Localized versus Itinerant Electrons in Solids). Description of electrons, from free atoms to crystals; band theory contrasted with crystal-field theory; evolution of electronic properties on passing from magnetic insulators to normal metals, from ionic to covalent solids, from single-valent compounds to mixed-valent systems; electron-lattice interactions and phase transitions; many examples. Additional prerequisite: A semester of quantum mechanics and a semester of solid-state science or technology.

Topic 10: Ionic Conductors: Same as Mechanical Engineering 386T (Topic 1: Ionic Conductors).

Topic 11: High-Temperature Superconductors: Same as Mechanical Engineering 386T (Topic 2: High-Temperature Superconductors).

Topic 12: Catalytic Electrodes: Same as Mechanical Engineering 386T (Topic 3: Catalytic Electrodes).

Topic 13: Magnetic Materials: Same as Mechanical Engineering 386T (Topic 4: Magnetic Materials).

Topic 14: Optical Interconnects:

Topic 15: Optoelectronics Integrated Circuits:

Topic 16: Semiconductor Lasers:

Topic 17: Localized-Electron Phenomena: Same as Mechanical Engineering 386R (Topic 2: Localized-Electron Phenomena). Analysis of the variation in physical properties versus chemical composition of several groups of isostructural transition-metal compounds. Additional prerequisite: A semester of solid-state science and/or quantum mechanics.

Topic 19: Plasma Processing of Semiconductors I: Plasma analysis using Boltzmann and fluid equations; plasma properties, including Debye length, quasineutrality, and sheaths; basic collisional properties, including Coulomb and polarization scattering; analysis of capacitive and wave-heated plasma processing reactors.

Topic 20: Plasma Processing of Semiconductors II: Plasma chemistry and equilibrium; analysis of molecular collisions; chemical kinetics and surface processes; plasma discharge particle and energy balance; analysis of inductive and DC plasma processing reactors; plasma etching, deposition, and implantation.

Topic 21: Submicron Device Physics and Techniques:

Topic 22: Semiconductor Microlithography:

Topic 23: Semiconductor Heterostructures:

Topic 24: Microwave Devices:

Topic 25: Organic and Polymer Semiconductor Devices:

Topic 26: Microelectromechanical Systems:

Topic 27: Charge Transport in Organic Semiconductors:

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Three lecture hours a week for one semester, or as required by the topic. May be repeated for credit when the topics vary. Prerequisite: Graduate standing and consent of instructor.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the letter-grade basis only. Prerequisite: Graduate standing in electrical engineering and consent of instructor and the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the letter-grade basis only. Prerequisite: Graduate standing in electrical engineering and consent of instructor and the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the letter-grade basis only. Prerequisite: Graduate standing in electrical engineering and consent of instructor and the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the letter-grade basis only. Prerequisite: Graduate standing in electrical engineering and consent of instructor and the graduate adviser.

Problem selected by the student with approval of the department. For each semester hour of credit earned, the equivalent of one lecture hour a week for one semester. Offered on the letter-grade basis only. Prerequisite: Graduate standing in electrical engineering and consent of instructor and the graduate adviser.

Selection of topics based on needs of an adequate number of students. May be repeated for credit when the topics vary. Prerequisite: Graduate standing in electrical engineering and consent of instructor.

Topic 1: Conference Course: May be repeated for credit.

Selection of topics based on needs of an adequate number of students. May be repeated for credit when the topics vary. Prerequisite: Graduate standing in electrical engineering and consent of instructor.

Topic 1: Conference Course: May be repeated for credit.

Selection of topics based on needs of an adequate number of students. May be repeated for credit when the topics vary. Prerequisite: Graduate standing in electrical engineering and consent of instructor.

Topic 1: Conference Course: May be repeated for credit.

Research associated with enrollment in the Graduate Research Internship Program (GRIP). Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of instructor.

Preparation of a report to fulfill the requirement for the master's degree under the report option. The equivalent of three lecture hours a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Preparation of a report to fulfill the requirement for the master's degree under the report option. The equivalent of three lecture hours a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Preparation of a report to fulfill the requirement for the master's degree under the report option. The equivalent of three lecture hours a week for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing in electrical engineering and consent of the graduate adviser.

Teaching under close supervision for one semester, attending group meetings or individual consultations, and submitting reports as required. Three lecture hours a week, or the equivalent, for one semester. Offered on the credit/no credit basis only. Prerequisite: Graduate standing and appointment as a teaching assistant.

Offered on the credit/no credit basis only. Prerequisite: Admission to candidacy for the doctoral degree.

Offered on the credit/no credit basis only. Prerequisite: Admission to candidacy for the doctoral degree.

Offered on the credit/no credit basis only. Prerequisite: Admission to candidacy for the doctoral degree.

Offered on the credit/no credit basis only. Prerequisite: Electrical Engineering 399R, 699R, or 999R.

Offered on the credit/no credit basis only. Prerequisite: Electrical Engineering 399R, 699R, or 999R.

Offered on the credit/no credit basis only. Prerequisite: Electrical Engineering 399R, 699R, or 999R.