‘DC to Daylight’: Harnessing the Spectrum and its Opportunities for Future Integrated Micro-systems

Seminar
Thursday, September 22, 2016
8:00 AM to 9:00 AM
POB 3.408
Free and open to the public

Integrated circuits now rely on transistors which are a few atoms in channel length integrated in a substrate which supports a billion of them interconnected in a multi-layer, complex metal interconnect mesh. While this has created fundamental challenges or ‘walls’ in processing scalability, it has also opened up new opportunities across the electromagnetic spectrum from DC-RF-optical frequencies that cut across traditional research boundaries.  As an example, the enormous signal processing capabilities when combined with RF had led to new communication architectures with properties such as reconfigurability, concurrency, cognition and multi-spectral capability, all of which are critical for efficiently using the EM spectrum for the next-generation wireless infrastructure.   Secondly, while scaling has pushed up operable frequencies into the higher mmWave region, the chip dimension also has become several times larger than the operating wavelengths. This allows new scattering and radiating properties where reconfigurable 2D THz radiating surfaces can be synthesized, manipulated and sensed at sub-wavelength scales for new forms of reconfigurable THz systems on chip.  Thirdly, the sub-100 nm lithography of interconnect layers in silicon ICs allows for integrated, complex, sub-wavelength metal-optical structures with multi-functional properties that can miniaturize traditional, bulky optical instrumentations into chip-scale optical sensors. In this talk, I will give examples across the spectrum from mm-Wave-THz-optics on reconfigurable mm-Wave transmitters exploiting multi-port network synthesis approaches, THz spectrum sensing using near-field EM scattering, and integrated fluorescence-based biosensors with nanoplasmonic waveguides in CMOS for massively multiplexed biomolecular assays on chip. Harnessing such a spectral expanse in one integrated platform with techniques combining circuits, electromagnetics, optics and signal processing can lead to new capabilities and open untapped opportunities across a wide range of applications in communication, sensing and imaging.

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Speaker

Kaushik Sengupta

Princeton University

Prof.Sengupta received the B.Tech. and M.Tech. degrees in electronics and electrical communication engineering from the Indian Institute of Technology (IIT), Kharagpur, India, both in 2007, and the M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology, Pasadena, CA, USA, in 2008 and 2012, respectively. In February 2013, he joined the faculty of the Department of Electrical Engineering, Princeton University, Princeton, NJ, USA.  He was the recipient of the IBM Ph.D. fellowship (2011), the IEEE Solid-State Circuits Society Pre-doctoral Achievement Award (2012), the IEEE Microwave Theory and Techniques Graduate Fellowship (2012), and the Analog Devices Outstanding Student Designer Award (2011). He was the recipient of the Charles Wilts Prize in 2013 from Electrical Engineering, Caltech for outstanding independent research in electrical engineering leading to a PhD. He was also the recipient of the Prime Minister Gold Medal Award of IIT (2007), the Caltech Institute Fellowship, He was selected in `Princeton Engineering Commendation List for Outstanding Teaching' in 2014. He serves on the Technical Program Committee of IEEE Custom Integrated Circuits conference and European Solid-state Circuits Conference. He was the co-recipient of the IEEE RFIC Symposium Best Student Paper Award in 2012 and 2015 Microwave Prize from IEEE Microwave Theory and Techniques Society.