Dr. Yongpan Liu received his B.S., M.S. and Ph.D. degrees from Electronic Engineering Department, Tsinghua University in 1999, 2002 and 2007. He has been a visiting scholar at Penn State University during summer 2014. He is a key member of Tsinghua-Rohm Research Center and Research Center of Future ICs. He is now an associate professor in Dept. of Electronic Engineering Tsinghua University. His main research interests include nonvolatile computation, low power VLSI design, emerging circuits and systems and design automation. His research is supported by NSFC, 863, 973 Program and Industry Companies such as Huawei, Rohm, Intel and so on. He has published over 60 peer-reviewed conference and journal papers and led over 6 chip design projects for sensing applications, including the first nonvolatile processor (THU1010N) and has received Design Contest Awards from (ISLPED2012, ISLPED2013) and several best paper candidates (ASPDAC2013, HPCA2015). He is an IEEE(ACM,IEICE) member and served on several conference technical program committees (DAC, ASP-DAC, ISLPED, A-SSCC, ICCD, VLSI-D, etc).