Emerging Trends in Electronic Packaging and Challenges for Modeling

Friday, April 07, 2017
10:00 AM to 11:00 AM
POB 2.402
Free and open to the public

With the advancement of Internet of Things and 5G technologies, systems architectures and designs from hand-held devices to high performance computing servers have to progress accordingly to provide an acceptable user experience. One area in system design that is profoundly impacted by this is packaging where both the system memory and the high speed SerDes bandwidth requirements result in distinct sets of challenges. This presentation will address some of these challenges and give examples of solutions in terms of emerging package architectures and technologies. Coupled with the same problem is the need for improved electrical design and analysis methods and tools. Examples of today’s package electrical analysis challenges together with some proposed solution directions for the computational research community will be presented.

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Kemal Aygun

Principal Engineer

Kemal Aygün (S’93-M’04-SM’11) received the Ph.D. degree in electrical and computer engineering from the University of Illinois at Urbana–Champaign, Champaign, IL, USA, in 2002. He joined the Intel Corporation, Chandler, AZ, USA, in 2003, where he is currently a Principal Engineer and manages the High Speed I/O team in the Electrical Core Competency Group. He holds 25 U.S. patents and has co-authored more than 60 journal and conference publications. His research interests include novel technologies along with electrical modeling and characterization techniques for microelectronic packaging. Dr. Aygün was a recipient of the SRC GRC Mahboob Khan Outstanding Mentor Award in 2008 and 2015.