Abstract: This talk highlights the latest advancements of the semiconductor industry that are enabling innovations in artificial intelligence (AI) and high-performance computing (HPC).  The presentation also provides the trend of technologies ranging from low-power and Edge AI devices to Data-center scale cloud computing.  By harnessing the new capabilities of semiconductor technologies, these innovations will greatly improve productivity, efficiency, safety, as well as sustainability. The semiconductor industry is indeed experiencing a “golden era” of AI and HPC in spurring remarkable economic growth and unleashing innovations to create a better future for society.

Biography: Dr. Geoffrey Yeap is Senior Vice President of Technology Development at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).  A recognized pioneer in advanced technologies, Dr. Yeap and his team are responsible for the development and mass production of the industry’s most critical logic technologies, including 5nm/4nm, 2nm, and the groundbreaking A16™—the world’s first Angstrom-class technology featuring backside direct contact power delivery. His work focuses on the holistic co-optimization of logic technologies with 3DIC advanced packaging to meet the scaling demands of AI and high-performance computing. With over 25 years of leadership at TSMC, Qualcomm, and Motorola, Dr. Yeap’s expertise spans the entire semiconductor lifecycle, from high-performance mobile architectures to design/technology co-optimization (DTCO). Before his current tenure at TSMC, he served as Vice President of Engineering at Qualcomm Technologies Inc., leading silicon engineering and design IP enablement.An IEEE Fellow, Dr. Yeap is a frequent keynote speaker and panelist at top-tier industry conferences, including IEDM, VLSI, and ISSCC. He holds more than 100 patents and has authored 70 refereed papers in leading journals and conferences. He earned his BSEE, MS, and PhD in microelectronics from The University of Texas at Austin.