The past two years have highlighted important vulnerabilities in supply chain and hardware security of microelectronics, and spurred large investments toward self-reliance for integrated circuits (ICs). IC foundries are looking not only at current demand, but at the inevitable trajectory of More-than-Moore materials and devices emerging for next-generation microelectronics needs. The increased interest and investment in semiconductors, micromanufacturing, and packaging presents a strategic opportunity to enhance functionality of ICs to broaden the possible range of System-on-Chip (SoC) and reduce system-level size, weight, power, and cost. Micro-electromechanical Systems (MEMS) offer compact, high-performance hardware solutions for sensors and actuators, communication, timing, ultrasonic imaging and stimulation, and energy harvesting . If MEMS can be embedded within ICs, whether in standard CMOS or in emerging 3D heterogeneously integrated (3DHI) platforms, trusted foundries can dramatically increase their microelectronics capabilities with little to no modification to their process flow or packaging. Moreover, embedded MEMS devices could provide chip-scale security through uniquely designed signatures.
This talk focuses on the design of acoustically waveguided modes achieved within standard CMOS technology. Methods for mode selection and optimization, confinement, and focusing are discussed. We show both analytically and experimentally the ability to realize high-Q resonance modes in multiple IC platforms ranging from ~100 MHz to ~30 GHz , . Dispersion engineering of the CMOS-stack acoustic metamaterial, under strict design rule check (DRC) constraints, to reduce spurious modes and minimize radiative losses is discussed. We also consider a complete model of these electromechanical devices for ease of system-level integration using industry-standard circuit design tools and process design kits (PDKs) provided by the foundry . Looking forward to emerging materials in CMOS, this talk also addresses opportunities and challenges to ferroelectric transducers, typically implemented for ferroelectric random access memory (FRAM).
Dana Weinstein is a Professor in Purdue’s Elmore Family School of Electrical and Computer Engineering, and Associate Dean of Graduate Education in the College of Engineering. Prior to joining Purdue in 2015, Dr. Weinstein joined the Department of Electrical Engineering and Computer Science at MIT as an Assistant Professor, and served as an Associate Professor there between 2013 and 2015. She received her B.A. in Physics and Astrophysics from University of California - Berkeley in 2004 and her Ph.D. in Applied Physics in 2009 from Cornell, working on multi-GHz MEMS. She is a Purdue Faculty Scholar, and a recipient of the NSF CAREER Award, the DARPA Young Faculty Award, the first Intel Early Career Award, the first TRF Transducers Early Career Award, and the IEEE IEDM Roger A. Haken Best Paper Award. Dr. Weinstein’s current research focuses on innovative microelectromechanical devices for applications ranging from MEMS-IC wireless communications and clocking to micro robotic actuators and ultrasonic stimulation.