David Z. Pan
Dr. David Z. Pan is a Professor in the Department of Electrical & Computer Engineering at The University of Texas at Austin and holds the Engineering Foundation Endowed Professorship #1.
He received his B.S. degree from Peking University, and his M.S./Ph.D. degrees from University of California at Los Angeles (UCLA). From 2000 to 2003, he was a Research Staff Member with the IBM T. J. Watson Research Center, Yorktown Heights, NY. His research is mainly focused on cross-layer nanometer design for manufacturing/reliability, new frontiers of physical design and system-level co-design, and CAD for emerging technologies. He has published over 300 technical papers in refereed journals and conferences, and is the holder of 8 U.S. patents. He has graduated over 20 PhD students at UT Austin.
He has served as a Senior Associate Editor of ACM Transactions on Design Automation of Electronic Systems (TODAES), an Associate Editor of IEEE Design & Test, IEEE Transactions on CAD, IEEE Transactions on VLSI, IEEE Transactions on CAS-I, IEEE Transactions on CAS-II, IEEE CAS Society Newsletter, Science China Information Sciences, and Journal of Computer Science and Technology. He has served in the committees of many major VLSI/CAD conferences (e.g., ASPDAC, DAC, DATE, ICCAD, ISPD, ISLPED) and played leadership roles such as Program Chair for ASP-DAC, ICCAD, ISPD, etc.
He has received the 2013 SRC Technical Excellence Award, DAC Top 10 Author in Fifth Decade, DAC Prolific Author Award, ASP-DAC Frequently Cited Author Award, 14 Best Paper Awards (HOST 2017, SPIE-AL 2016, ISPD 2014, ICCAD 2013, ASPDAC 2012, ISPD 2011, IBM Research Pat Goldberg Memorial Best Paper Award 2010 in CS/EE/Math, ASPDAC 2010, DATE 2009, ICICDT 2009, SRC Techcon 2015, 2012, 2007 and 1998), Communications of the ACM Research Highlights (2014), ACM/SIGDA Outstanding New Faculty Award (2005), NSF CAREER Award (2007), UCLA Engineering Distinguished Young Alumnus Award (2009), UT Austin RAISE Faculty Excellence Award (2014), IBM Faculty Award four times, SRC Inventor Recognition Award three times, a number of international CAD contest awards, among others. He is a Fellow of IEEE and SPIE.